LANSON always requires to purchase high-quality solder paste for production, such as Senju alpha, loctite and other well-known brands, which can also be produced with uneven surface.
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For core devices such as QFN, the packaging is unique and the process is difficult. The side of the welding end is exposed and there is no weldable coating. Generally speaking, the weldability of the left and right sides of the welding end is very poor in SMT processing, which is prone to poor wetting, bridging and voids. In this case, it is mainly because the thin solder paste is more likely to form a larger cavity. The main reason is that the thickness gap of the weld is too small, which makes it more difficult for the volatiles of the welding machine to be discharged through this "channel", resulting in the problem of "cavity".
